Scope & Topic

Big Data Analytics & Data Mining for Smart Manufacturing

Industry 4.0 & Cyber-Physical Systems

AI & Computational Intelligence for Smart Manufacturing

Advanced Process Control/ Advanced Equipment Control

Internet of Things (IOT)

Virtual Metrology, Tool Health, Fault Detection & Classification

Manufacturing Intelligence, Evolutionary Algorithms

Circular Economics, Green Supply Chain & Sustainability

Decision Technologies, Modeling & Decision Analysis

Augmented Reality, Virtual Reality

Simulation Optimization & Applications

Manufacturing Strategy & Manufacturing Innovation

Corporate Resource Planning & ERP

User Experience & Innovative Design

Smart Production Facilities & Green Fab

Human-machine Collaboration, Ergonomics & Safety

Predictive Maintenance, Quality & Reliability

Total Resource Management & Overall Resource Effectiveness

Semiconductor & High-tech Manufacturing

Applications of Industrial Engineering & Logistics




Welcome to Hsinchu, Taiwan. It is our great privilege to hold the 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018). ISMI2018 aims to disseminate recent theoretical and methodological developments, significant technical applications, and case studies in semiconductor and high-tech manufacturing. Following the great success of ISMI in Taiwan (2012), Shanghai (2013), Taiwan (2014), South Korea (2015), and Taiwan (2016). ISMI2018 in Taiwan is going to serve to enhance collaborations among academia and industries. Under the main theme of Industry 4.0, the objective of the ISMI2018 aims to provide a platform to foster the exchange of research developments and latest practice on automation science & engineering, evolutionary algorithms, data mining and big data analytics, manufacturing informatics, modeling and decision analysis, and operation management for semiconductor and high-tech manufacturing to enhance collaborations among academia and industries. Furthermore, the involved research and applications are not limited to conventional manufacturing domains and can be extended to manufacturing-based services as well as emerging areas such as green supply chains, logistics, and business analysis and optimization.

This event is co-organized by National Tsing Hua University (NTHU), Chinese Institute of Industrial Engineers (CIIE), Society for Excelling Enterprises & Decisions (SEED), Semiconductor Technologies Empowerment Partners Consortium (STEP, MOST), NTHU-TSMC Center for Manufacturing Excellence, School of Extension Education, Soochow University, Dept. of Business Administration, Asia University, Dept. of Industrial and Systems Engineering, Chung Yuan Christian University, Dept. of Industrial Engineering and Engineering Management, NTHU, Dept. of Industrial Engineering and Management, National Chiao Tung University, Dept. of Industrial Engineering and Systems Management, Feng Chia University, Institute of Industrial Engineering, National Taiwan University, and Coil Technology Corp. (CTC).

This event is co-sponsored by the Ministry of Science and Technology (MOST), Ministry of Education (MOE), Bureau of Foreign Trade, Ministry of Economic Affairs (MOEA), Scientific Formosa, Inc. (SFI), Artificial Intelligence for Intelligent Manufacturing Systems (AIMS) Research Center, MOST, IEEE Technical Committee on Semiconductor Manufacturing Automation, Taiwan Semiconductor Industry Association (TSIA), and Semiconductor Equipment and Materials International (SEMI Taiwan). Finally, we would like to thank all of the participants and organizers for their contributions in this successful joint event in Hsinchu, Taiwan.

Chen-Fu Chien, Ph.D.

ISMI2018& IEEE SMILE2018 General Chair

Convener, Industrial Engineering and Management Program, Ministry of Science & Technology

Tsinghua Chair Professor, National Tsing Hua University, Taiwan


Jei-Zheng Wu, Ph.D.

ISMI2018& IEEE SMILE2018 General Co-Chair

President, Society for Excelling Enterprises and Decisions (SEED)

Associate Professor & Director, School of Extension Education, Soochow University, Taiwan


Runliang Dou, Ph.D.

ISMI2018& IEEE SMILE2018 General Co-Chair

Standing Deputy Executive Director & Office Director, Chinese Industrial Engineering Institution

Professor, Tianjin University, China

February 7th - 9th, 2018