Call for Paper

Posted: 11/10/2017 Last update: 11/17/2017

2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018)

& 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (IEEE SMILE 2018)

Conference Chairs: Chen-Fu Chien, Jei-Zheng Wu, & Runliang Dou

February 7 - 9, 2018, Hsinchu, Taiwan

Aims and Topics:

The joint conference of 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018) and 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE 2018) aims to disseminate recent theoretical and methodological developments, applications, and case studies in light of ongoing revolutions for manufacturing intelligence and smart manufacturing. Topics of interest include, but are not limited to, the following:

Big Data Analytics & Data Mining for Smart Manufacturing

Industry 4.0 & Cyber-Physical Systems

AI & Computational Intelligence for Smart Manufacturing

Advanced Process Control/ Advanced Equipment Control

Internet of Things (IOT)

Virtual Metrology, Tool Health, Fault Detection & Classification

Manufacturing Intelligence, Evolutionary Algorithms

Circular Economics, Green Supply Chain & Sustainability

Decision Technologies, Modeling & Decision Analysis

Augmented Reality, Virtual Reality

Simulation Optimization & Applications

Manufacturing Strategy & Manufacturing Innovation

Corporate Resource Planning & ERP

User Experience & Innovative Design

Smart Production Facilities & Green Fab

Human-machine Collaboration, Ergonomics & Safety

Predictive Maintenance, Quality & Reliability

Total Resource Management & Overall Resource Effectiveness

Semiconductor & High-tech Manufacturing

Applications of Industrial Engineering & Logistics

Organized/sponsored by:

NTHU-TSMC Center for Manufacturing Excellence, National Tsing Hua University

Industrial Engineering and Management Program, Ministry of Science and Technology, Taiwan

Society for Excelling Enterprises and Decisions (SEED), Taiwan

Paper submission:

All papers must be written in English with a maximum length of 6 pages. Paper format, submission, and related information is updated: and submission page: For more details, please consult Conference General Co-Chair, Professor Jei-Zheng Wu (

Special Issues for Post-Conference Publication:

Conference proceedings of full papers will be published by IEEE Xplore that is indexed by Ei Compendex. Selected papers will be recommended for reviews and possible publications in special issues of SCI journals including Journal of Intelligent Manufacturing, Computers & Industrial Engineering, and others.

Important Dates:

Deadline for Full Paper Submission for EI-Indexed Proceedings for IEEE Xplore:      October 31, 2017 (==CLOSE==)

Deadline for Presentation-only Abstract Submission:                                                   December 31, 2017

Deadline for Full Paper Submission (for Best Paper/Student Paper Award entry):      December 31, 2017

Early Bird Registration (OPENED!!):                                                                             December 31, 2017

Camera Ready Manuscript Submission:                                                                       January 14, 2018

Registration Fee:

Full registration:           US$500 (Early bird, before December 10, 2017) / US$600 (Regular)

Student registration:    US$350 (Early bird, before December 30, 2017) / US$400 (Regular)

Tutorial Session, Exhibit, and Factory Visiting:

This conference will provide a platform for related activities such as tutorial, exhibit, and factory visiting to enrich conference.

Venue: National Tsing Hua University ( (special offers of NTHU guest house and hotels nearby are available; visitor guide will be provided in advance for visiting Taiwan and local tours).